FO 1500mesh Lapping Powder D50:5.5±0.5um
| Item | Size | Specific Gravity | Al2O3 | SiO2 | Fe2O3 | TiO2 | ZrO2 |
| FO lapping powder | 1500mesh | ≥3.90 | ≥40.5% | ≤20.0% | ≤0.7% | ≤2.0% | ≤33.0% |
PSD(Particle Size Distribution) of FO 1500mesh Lapping Powder D50:5.5±0.5um
| Size | D0(um) | D3(um) | D50(um) | D94(um) |
| 1500mesh | ≤19.0 | ≤17.0 | 5.5±0.5 | ≥3.0 |
FO Lapping Powder Main Applications
–Grinding and polishing of semiconductor wafers
–Surface finishing of various optical glasses
–Grinding and polishing of lenses, prisms, mirrors, filters, etc. of optical crystals.
–Surface finishing of piezoelectric materials
Packing of FO Lapping Powder
10kgs pvc bags+pallet
