FO 1000/1200/1500 for Silicon Wafers grinding and polishing
FO 1000/1200/1500 for Silicon Wafers grinding and polishing Physical properties and Chemical composition %
| item | Size | Specific gravity (g/cm3) | Chemical（%） | ||||
| Al2O3 | SiO2 | Fe2O3 | TiO2 | ZrO2 | |||
| Optical emery | #800-#1200 | ≥3.90 | ≥45.0 | ≤20.0 | ≤0.5 | ≤2.0 | ≤33.0 |
| #1500-#3000 | ≥3.90 | ≥40.5 | ≤20.0 | ≤0.7 | ≤2.0 | ≤33.0 | |
PSD(Particle Size Distribution) of FO 1000/1200/1500 for Silicon Wafers grinding and polishing
| Size | D0(um) | D3(um) | D50(um) | D94(um) |
| #800 | ≤32.0 | ≤27.0 | 11.3±0.9 | ≥6.5 |
| #1000 | ≤27.0 | ≤23.0 | 9.4±0.8 | ≥5.0 |
| #1200 | ≤23.0 | ≤20.0 | 7.1±0.7 | ≥4.0 |
| #1500 | ≤19.0 | ≤17.0 | 5.5±0.5 | ≥3.0 |
| #2000 | ≤15.0 | ≤14.0 | 4.5±0.4 | ≥2.0 |
| #3000 | ≤12.0 | ≤11.0 | 3.6±0.4 | ≥1.5 |
FO 1000/1200/1500 for Silicon Wafers grinding and polishing Main Applications
–Grinding and polishing of semiconductor wafers
–Surface finishing of various optical glasses
–Grinding and polishing of lenses, prisms, mirrors, filters, etc. of optical crystals.
–Surface finishing of piezoelectric materials
Packing of FO 1000/1200/1500 for Silicon Wafers grinding and polishing
10kgs pvc bags+pallet
