FO lapping powder 2000mesh,similar FUJIMI
Physical properties and Chemical composition of FO lapping powder 2000mesh,similar FUJIMI
| Item | Size | Specific Gravity | Al2O3 | SiO2 | Fe2O3 | TiO2 | ZrO2 |
| FO | 2000# | ≥3.90 | ≥40.5% | ≤20.0% | ≤0.7% | ≤2.0% | ≤33.0% |
PSD(Particle Size Distribution) of FO 1500 lapping powder
| Size | D0 | D3 | D50 | D94 |
| #2000 | ≤15.0 | ≤14.0 | 4.5±0.4 | ≥2.0 |
FO lapping powder Main Applications
–Grinding and polishing of semiconductor wafers
–Surface finishing of various optical glasses
–Grinding and polishing of lenses, prisms, mirrors, filters, etc. of optical crystals.
–Surface finishing of piezoelectric materials
Packing of FO lapping powder
20kgs paper bags+pallet
