Similar FUJIMI,FO 1500 lapping powder
| Item | Size | Specific Gravity | Al2O3 | SiO2 | Fe2O3 | TiO2 | ZrO2 |
| FO | 1500# | ≥3.90 | ≥40.5% | ≤20.0% | ≤0.7% | ≤2.0% | ≤33.0% |
PSD(Particle Size Distribution) of FO 1500 lapping powder
| Size | D0 | D3 | D50 | D94 |
| #1500 | ≤19.0 | ≤17.0 | 5.5±0.5 | ≥3.0 |
FO lapping powder Main Applications
–Grinding and polishing of semiconductor wafers
–Surface finishing of various optical glasses
–Grinding and polishing of lenses, prisms, mirrors, filters, etc. of optical crystals.
–Surface finishing of piezoelectric materials
Packing of FO lapping powder
10kgs pvc bags+pallet
