FO 1000/1200/1500 for Grinding Semiconductor Wafers
FO 1000/1200/1500 for Grinding Semiconductor Wafers Physical properties and Chemical composition %
| item | Size | Specific gravity (g/cm3) | Chemical（%） | ||||
| Al2O3 | SiO2 | Fe2O3 | TiO2 | ZrO2 | |||
| Optical emery | #800-#1200 | ≥3.90 | ≥45.0 | ≤20.0 | ≤0.5 | ≤2.0 | ≤33.0 |
| #1500-#3000 | ≥3.90 | ≥40.5 | ≤20.0 | ≤0.7 | ≤2.0 | ≤33.0 | |
PSD(Particle Size Distribution) of FO 1000/1200/1500 for Grinding Semiconductor Wafers
| Size | D0(um) | D3(um) | D50(um) | D94(um) |
| #800 | ≤32.0 | ≤27.0 | 11.3±0.9 | ≥6.5 |
| #1000 | ≤27.0 | ≤23.0 | 9.4±0.8 | ≥5.0 |
| #1200 | ≤23.0 | ≤20.0 | 7.1±0.7 | ≥4.0 |
| #1500 | ≤19.0 | ≤17.0 | 5.5±0.5 | ≥3.0 |
| #2000 | ≤15.0 | ≤14.0 | 4.5±0.4 | ≥2.0 |
| #3000 | ≤12.0 | ≤11.0 | 3.6±0.4 | ≥1.5 |
FO 1000/1200/1500 for Grinding Semiconductor Wafers Main Applications
–Grinding and polishing of semiconductor wafers
–Surface finishing of various optical glasses
–Grinding and polishing of lenses, prisms, mirrors, filters, etc. of optical crystals.
–Surface finishing of piezoelectric materials
Packing of FO 1000/1200/1500 for Grinding Semiconductor Wafers
10kgs pvc bags+pallet
