Similar FUJIMI,FO 3000 lapping powder
Physical properties and Chemical composition of FO 3000 lapping powder,similar FUJIMI
| Item | Size | Specific Gravity | Al2O3 | SiO2 | Fe2O3 | TiO2 | ZrO2 |
| FO | 3000# | ≥3.90 | ≥40.5% | ≤20.0% | ≤0.7% | ≤2.0% | ≤33.0% |
PSD(Particle Size Distribution) of FO 3000 lapping powder
| Size | D0 | D3 | D50 | D94 |
| #3000 | ≤12.0 | ≤11.0 | 3.6±0.4 | ≥1.5 |
FO lapping powder Main Applications
–Grinding and polishing of semiconductor wafers
–Surface finishing of various optical glasses
–Grinding and polishing of lenses, prisms, mirrors, filters, etc. of optical crystals.
–Surface finishing of piezoelectric materials
Packing of FO lapping powder
20kgs paper bags+pallet
