Specification of FO#1200 for grinding 12 inch silicon wafer
Standard Chemical composition of FO#1200 for grinding 12 inch silicon wafer is as follows:
| Item | Size | Al2O3 | SiO2 | Fe2O3 | TiO2 | ZrO2 |
| FO | #1200 | ≥45.0% | ≤20.0% | ≤0.5% | ≤2.0% | ≤33.0% |
The real test report of FO #1200 produced by Zhengzhou haixu abrasives co.,ltd is as follows:
| Size | D0 | D3 | D50 | D94 |
| #1200 | ≤23.0 | ≤20.0 | 7.1±0.7 | ≥4.0 |
The real PSD of FO #1200 produced by Zhengzhou haixu abrasives co.,ltd is as follows:
