Specification of FO lapping powder,similar FUJIMI
Physical properties and Chemical composition %
| item | Size | Specific gravity (g/cm3) | chemical（%） | ||||
| Al2O3 | SiO2 | Fe2O3 | TiO2 | ZrO2 | |||
| FO | #800-#1200 | ≥3.90 | ≥45.0 | ≤20.0 | ≤0.5 | ≤2.0 | ≤33.0 |
| #1500-3000 | ≥3.90 | ≥40.5 | ≤20.0 | ≤0.7 | ≤2.0 | ≤33.0 | |
PSD(Particle Size Distribution)
| Size | D0 | D3 | D50 | D94 |
| #800 | ≤32.0 | ≤27.0 | 11.3±0.9 | ≥6.5 |
| #1000 | ≤27.0 | ≤23.0 | 9.4±0.8 | ≥5.0 |
| #1200 | ≤23.0 | ≤20.0 | 7.1±0.7 | ≥4.0 |
| #1500 | ≤19.0 | ≤17.0 | 5.5±0.5 | ≥3.0 |
| #2000 | ≤15.0 | ≤14.0 | 4.5±0.4 | ≥2.0 |
| #3000 | ≤12.0 | ≤11.0 | 3.6±0.4 | ≥1.5 |
Main Applications
–Grinding and polishing of semiconductor wafers
–Surface finishing of various optical glasses
–Grinding and polishing of lenses, prisms, mirrors, filters, etc. of optical crystals.
–Surface finishing of piezoelectric materials
Packing
20kgs paper bags+pallet