Similar FUJIMI,FO 1000 lapping powder
Physical properties and Chemical composition of Similar FUJIMI,FO 1000 lapping powder
| Item | Size | Specific Gravity | Al2O3 | SiO2 | Fe2O3 | TiO2 | ZrO2 |
| FO | 1000# | ≥3.90 | ≥45.0% | ≤20.0% | ≤0.5% | ≤2.0% | ≤33.0% |
PSD(Particle Size Distribution) of FO 1200 lapping powder
| Size | D0 | D3 | D50 | D94 |
| #1000 | ≤27.0 | ≤23.0 | 9.4±0.8 | ≥5.0 |
FO lapping powder Main Applications
–Grinding and polishing of semiconductor wafers
–Surface finishing of various optical glasses
–Grinding and polishing of lenses, prisms, mirrors, filters, etc. of optical crystals.
–Surface finishing of piezoelectric materials
Packing of lapping powder
20kgs paper bags+pallet
