TDS OF FO 1200MESH FOR GRINDING SILICON WAFERS
PRODUCT:FO SIZE:1200mesh
FO IS A KIND OF GRINDING & LAPPING POWDER,A HIGH-PRECISION,ALUMINA-BASED ABRASIVE POWDER DESIGNED FOR FINE LAPPING AND SUREFACE FINISHING,ESPECIALLY FOR PRECISION LAPPING OF SEMICONDUCTOR DEVICE AND SILICON WAFERS.
AVERAGE CHEMICAL COMPOSITION(TYPICAL)
| Size | S.G(g/cm3) | CHEMICAL COMPOSITION（%） | ||||
| Al2O3 | SiO2 | Fe2O3 | TiO2 | ZrO2 | ||
| 1200mesh | ≥3.90 | ≥45.0 | ≤20.0 | ≤0.5 | ≤2.0 | ≤33.0 |
PARTICLE SIZE DISTRIBUTION
| Size | D0 | D3 | D50 | D94 |
| 1200mesh | ≤23.0 | ≤20.0 | 7.1±0.7 | ≥4.0 |
MAIN APPLICATIONS
–GRINDING AND POLISHING OF SEMICONDUCTOR WAFERS,SILICON WAFERS ETC
–SURFACE FINISHING OF VARIOUS OPTICAL GLASSES
–GRINDING AND POLISHING OF LENSES,PRISMS,MIRRORS,FILTERS,ETC
–SURFACE FINISHING OF PIEZOELECTRIC MATERIALS
–FIBER OPTIC FERRULES,LAPPING FILMS
–ALUMINA AND ALUMINUM NITRIDE SUBSTRATES;SEMICONDUCTORS CERAMIC COMPONENTS
–WAFER THINNING AND DOUBLE-SIDED GRINDING
…
PACKAGING
10KGS PVC BAGS+ PALLET