FO 1200 lapping powder,similar FUJIMI
Physical properties and Chemical composition of FO 1200 lapping powder ,similar FUJIMI
| Item | Size | Specific Gravity | Al2O3 | SiO2 | Fe2O3 | TiO2 | ZrO2 |
| FO | 1200# | ≥3.90 | ≥45.0% | ≤20.0% | ≤0.5% | ≤2.0% | ≤33.0% |
PSD(Particle Size Distribution) of FO 1200 lapping powder
| Size | D0 | D3 | D50 | D94 |
| #1200 | ≤23.0 | ≤20.0 | 7.1±0.7 | ≥4.0 |
FO lapping powder Main Applications
–Grinding and polishing of semiconductor wafers
–Surface finishing of various optical glasses
–Grinding and polishing of lenses, prisms, mirrors, filters, etc. of optical crystals.
–Surface finishing of piezoelectric materials
Packing of lapping powder
20kgs paper bags+pallet
