Why can white fused alumina be used for grinding and polishing chips?

Why can white fused alumina be used for grinding and polishing chips?
White fused alumina is also called white corundum, white aluminum oxide, which owns the characteristics of high hardness, good self-sharpening, acid and alkali corrosion resistance, high temperature resistance, and stable thermal performance.
As the core material for grinding and polishing chips, white fused alumina is mainly based on its unique physical and chemical properties, which perfectly meet the stringent requirements of chip manufacturing for high precision and low pollution:
‌1. Physical performance advantages‌
‌Ultra-high hardness and precision cutting‌
The Mohs hardness of white fused alumina is above 9.0 (lower only to diamond and silicon carbide), the particles are sharp and self-sharpening (automatic trimming during grinding keeps the edge sharp), which can efficiently remove micron-level unevenness on the surface of silicon wafers and achieve atomic-level surface flatness.
‌Particle size uniformity and stability‌
The particle size of the micro powder is controlled by the traditional overflow classification process, and the distribution is uniform and concentrated, ensuring that the grinding pressure is evenly distributed, avoiding scratches or pits, and ensuring the surface finish and dimensional accuracy of the chip.
‌Excellent thermal stability‌
Maintains stable physical properties in high temperature environment, significantly reduces the risk of thermal expansion during the grinding process, and protects the chip structure from thermal damage.
2.chemical properties guarantee‌
‌High purity and chemical inertness‌
The main component of whtie fused alumina is α-alumina (purity>99%), which contains almost no metal impurities such as iron (extremely low iron content), and does not react chemically with silicon wafers during grinding, completely avoiding chip surface contamination or oxidation.
‌Environmental safety‌
No radioactive pollution, in line with the strict standards of semiconductor manufacturing for material safety.
3.adapt to chip manufacturing process‌
‌Core components of polishing liquid‌
White fused alumina micropowder is used as the key abrasive in the polishing liquid. It achieves nano-level flattening of silicon wafers through wet polishing, meeting the extreme requirements of chip circuit stacking for surface flatness.
‌Multi-scenario applicability‌
Compatible with multiple processes such as dry grinding, wet grinding, chemical mechanical polishing (CMP), and flexible adaptation to the grinding needs of different stages of chip manufacturing.
4. Advantages over other materials‌
Compared with silicon carbide (slightly poor chemical stability) or ordinary alumina (slightly lower purity), white fused alumina is irreplaceable in purity, hardness uniformity and chemical inertness, and is particularly suitable for semiconductor manufacturing with extremely low tolerance for impurities.
‌Summary‌
White fused alumina relies on its ultra-high hardness + self-sharpening to ensure grinding efficiency, nano-level particle size control + thermal stability to achieve precision machining, and 99% purity + chemical inertness to eliminate pollution, making it an irreplaceable material for chip grinding and polishing. Its application in semiconductor polishing liquid directly supports the miniaturization and high performance development of modern chips.